
Contents
page 4 Beckhoff New Automation Technology CB3056
4.3.8 H/W Monitor ........................................................................................................................ 52
4.3.9 Serial Port Console Redirection .......................................................................................... 54
4.3.10 CPU PPM Configuration...................................................................................................... 56
4.4 Chipset ........................................................................................................................................ 57
4.4.1 PCH-IO Configuration ......................................................................................................... 58
4.4.2 System Agent (SA) Configuration ....................................................................................... 65
4.5 Boot ............................................................................................................................................. 69
4.5.1 CSM Parameters ................................................................................................................. 71
4.6 Security ....................................................................................................................................... 72
4.6.1 Secure Boot Policy .............................................................................................................. 73
4.6.2 Key Management ................................................................................................................ 74
4.7 Save & Exit .................................................................................................................................. 76
4.8 BIOS update ................................................................................................................................ 77
5 Mechanical Drawings ......................................................................................................................... 78
5.1 PCB: Mounting Holes .................................................................................................................. 78
5.2 PCB: Pin 1 Dimensions ............................................................................................................... 79
5.3 PCB: Die Center .......................................................................................................................... 80
6 Technical Data .................................................................................................................................... 81
6.1 Electrical Data ............................................................................................................................. 81
6.2 Environmental Conditions ........................................................................................................... 81
6.3 Thermal Specifications ................................................................................................................ 82
7 Support and Service ........................................................................................................................... 83
7.1 Beckhoff's Branch Offices and Representatives ......................................................................... 83
7.2 Beckhoff Headquarters................................................................................................................ 83
7.2.1 Beckhoff Support ................................................................................................................. 83
7.2.2 Beckhoff Service ................................................................................................................. 83
I Annex: Post-Codes ............................................................................................................................. 84
II Annex: Resources .............................................................................................................................. 85
IO Range ................................................................................................................................................. 85
Memory Range ....................................................................................................................................... 85
Interrupt ................................................................................................................................................... 85
PCI Devices ............................................................................................................................................ 86
SMB Devices .......................................................................................................................................... 86
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