
Inhalt
Seite 4 Beckhoff New Automation Technology CB4060
5.3.4 CPU Configuration .............................................................................................................. 49
5.3.5 SATA Configuration ............................................................................................................ 52
5.3.6 AMT Configuration .............................................................................................................. 55
5.3.7 Power Controller Options ................................................................................................... 57
5.3.8 USB Configuration .............................................................................................................. 59
5.3.9 Super IO Configuration ....................................................................................................... 60
5.3.10 H/W Monitor ........................................................................................................................ 62
5.3.11 Serial Port Console Redirection ......................................................................................... 64
5.3.12 Network Stack ..................................................................................................................... 67
5.3.13 Intel(R) Ethernet Connection I218-LM ................................................................................ 68
5.3.14 Intel(R) I210 Gigabit Network Connection .......................................................................... 70
5.3.15 Driver Health ....................................................................................................................... 72
5.4 Chipset ........................................................................................................................................ 74
5.4.1 PCH-IO Configuration ......................................................................................................... 75
5.4.2 System Agent (SA) Configuration ....................................................................................... 82
5.5 Boot ............................................................................................................................................ 92
5.5.1 CSM16 Parameters ............................................................................................................ 94
5.5.2 CSM Parameters ................................................................................................................ 95
5.6 Security ....................................................................................................................................... 96
5.6.1 Secure Boot Menu .............................................................................................................. 97
5.7 Save & Exit ............................................................................................................................... 100
5.8 BIOS-Update ............................................................................................................................ 101
6 Mechanische Zeichnung .................................................................................................................. 102
6.1 Leiterplatte: Bohrungen ............................................................................................................ 102
6.2 Leiterplatte: Pin-1-Abstände Top .............................................................................................. 103
6.3 Leiterplatte: Pin-1-Abstände Bottom ........................................................................................ 104
6.4 Leiterplatte: Kühlkörper/Die Center .......................................................................................... 105
7 Technische Daten ............................................................................................................................ 106
7.1 Elektrische Daten ..................................................................................................................... 106
7.2 Umgebungsbedingungen ......................................................................................................... 106
7.3 Thermische Spezifikationen ..................................................................................................... 107
8 Support und Service ........................................................................................................................ 108
8.1 Beckhoff-Support ...................................................................................................................... 108
8.2 Beckhoff-Service ...................................................................................................................... 108
8.3 Beckhoff-Firmenzentrale .......................................................................................................... 108
I Anhang: Post-Codes ........................................................................................................................ 110
II Anhang: Ressourcen ....................................................................................................................... 112
IO-Bereich ............................................................................................................................................ 112
Memory-Bereich ................................................................................................................................... 112
Interrupt ................................................................................................................................................ 112
PCI-Devices ......................................................................................................................................... 113
Ressourcen: SMB-Devices .................................................................................................................. 114
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