
PCB: Heat Sink/Die Center Chapter: Mechanical Drawings
Beckhoff New Automation Technology CB4063 page 81
6.4 PCB: Heat Sink/Die Center
Mounting Hole
Chip-DIE cooling
Electrical isolated cooling required
Center Point Cooling Area
Dotted Line = Chip outline
Solid Line = Cooling Area
2850
2260
1670
Mounting Hole dimension H1-H3: inner diameter 71; outer diameter 118
1455
2045
H2
1140
H3
H1
2260
Komentarze do niniejszej Instrukcji